Series and parallel hybrid switched capacitor networks for ic power delivery

ABSTRACT

Series switches for power delivery. A regulator operated as a current source is arranged in parallel with a switched capacitor divider. A switched capacitor divider is configured in series with a plurality of linear regulators with each regulating one of a plurality of voltage outputs from the switched capacitor divider. In another embodiment, a series switch bridge has a first pair of switches connected in series with a second pair of switches across a voltage input, each switch within a pair of switches is switched in-phase with the other while the first pair of switches is switched out of phase with the second pair of switches. A balancing capacitor is coupled across one switch in both the first and second pair to be in parallel when either of the pair of switches is closed to reduce a charge imbalance between the switches.

TECHNICAL FIELD

Embodiments of the present invention are in the field of semiconductordevices, more specifically pertaining to switched capacitor networks forIC power delivery.

BACKGROUND

Presently, power delivery to integrated circuits (ICs), such as amicroprocessor or a central processing unit (CPU), within an electronicdevice, such as a computer, relies on a buck voltage regulator. Thistype of regulator usually has low efficiency at light loads and onlyperforms well at high loads. In ultra-mobile computing platforms, whereloads may be very light, buck-type regulators may frequently operatewell below their peak (maximum) efficiency.

As electronic devices trend toward power reduction and simultaneousintegration of more diverse features, the power delivery network mustprovide power at a number of different voltage levels for different ofinterfaces and functionalities. These interfaces may be on a singlecomponent, such as IC 106, or distributed across multiplecomponents/ICs. For example, as depicted in FIG. 1, mobile computingdevice 100 includes a motherboard 105 which supports a chipset requiringat least three different regulated voltage rails. This is achieved instages with a voltage regulator (VR) 110 to regulate a power supply,such as Li-ion cell(s) 106 to a first voltage level of 3V. VR 110accommodates the range of voltages a Li-ion battery may outputthroughout various levels of discharge (e.g., 4.2V-4.8V/cell). Asfurther shown, point of load (POL) voltage regulators coupled with VR110 then provide a second stage of power delivery for each of any numberof output load circuits on the motherboard 105. For example, VR 111provides a 1.3V rail to memory 140, VR 112 provides a 1.75V rail to aSerial Advanced Technology Attachment (SATA/100, SATA/300, SATA/600etc.) compliant interface 145 and VR 113 provides 2.3V to PCI Expresschipset (PCIe v1.1, PCIe 2.0, etc.) 150. With additional POL voltageregulators potentially required for a Universal Serial Bus (USB 1.1,2.0, 3.0, etc.), a processor unit, etc., the area of motherboard 105consumed by voltage regulators may approach 40%.

Correspondingly, a need exists for a readily scalable power deliverynetwork which can be operated efficiently over a range of loads and canbe integrated into a smaller form factor.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention are illustrated by way of example,and not limitation, in the figures of the accompanying drawings inwhich:

FIG. 1 is a block diagram schematically illustrating conventionallyimplemented power delivery network;

FIG. 2A is a block diagram of a parallel hybrid power delivery networkemploying a switched capacitor divider in parallel with a currentregulator, in accordance with one embodiment;

FIG. 2B is a diagram schematically illustrating a divide-by-fourswitched capacitor divider, in accordance with one embodiment;

FIG. 3 is a block diagram of a parallel hybrid power delivery networkemploying a switched capacitor divider in parallel with a linearregulator, in accordance with one embodiment;

FIG. 4A is a block diagram of a parallel hybrid power delivery networkemploying a switched capacitor divider in parallel with a buckconverter, in accordance with one embodiment;

FIG. 4B is a schematic of a simulation for a parallel hybrid powerdelivery network employing a divide-by-four switched capacitor dividerin parallel with a buck converter, in accordance with one embodiment;

FIG. 5A is a graph depicting a time domain simulation of adivide-by-four switched capacitor divider operated without a buckconverter in parallel;

FIG. 5B is a graph depicting a time domain simulation of the schematicdepicted in FIG. 4B, in accordance with one embodiment;

FIG. 5C is a block diagram of a control strategy for determining theamount of current a current regulator operated in parallel with aswitched capacitor divider, in accordance with one embodiment;

FIG. 5D is a graph depicting transition currents for a controlledcurrent regulator operated in parallel with a switched capacitordivider, in accordance with one embodiment;

FIG. 6A-6C are block diagrams schematically illustrating a powerdelivery employing a current regulator configured in parallel with aswitched capacitor divider, in accordance with embodiments;

FIG. 7A, block diagrams schematically illustrating a power deliveryemploying a switched capacitor divider configured in series with aplurality of linear regulators in accordance with one embodiment;

FIG. 7B is a schematic for a simulation of a divide-by-four switchedcapacitor divider configured in series with a plurality of linearregulators, in accordance with one embodiment;

FIG. 8 is a circuit topology schematically illustrating a voltagebalance capacitor in a switched capacitor bridge circuit with seriespairs for the top and bottom switch paths, in accordance with oneembodiment;

FIG. 9A is a schematic for a simulation of the circuit topology depictedin FIG. 8, in accordance with one embodiment;

FIG. 9B is a graph depicting a simulation of the circuit topologydepicted in FIG. 8, in accordance with one embodiment; and

FIG. 9C is a graph depicting a simulation of the circuit topologydepicted in FIG. 8 without the balancing capacitor.

DETAILED DESCRIPTION

Series switches for power delivery are described herein with referenceto figures. In one embodiment, a series switch network is employed in ahybrid power conversion stage including a converter of a first type anda second type configured in parallel to provide a regulated outputcurrent from an input voltage. In certain embodiments, a switchedcapacitor converter is employed in parallel with a current regulator. Inspecific embodiments, a buck regulator or linear regulator configured tooperate as a current source is arranged in parallel with a switchedcapacitor divider. The amount of output current provided by the currentsource is then controlled to provide high efficiency operation at bothlight and heavy loads.

In another embodiment, series switches are employed in a switchedcapacitor divider configured in series with a plurality of linearregulator (LR) with each LR regulating one of a plurality of firstvoltage outputs from the switched capacitor divider to a second voltageoutput.

In another embodiment, series switches are employed in a series switchbridge having a first pair of switches connected in series with a secondpair of switches across a voltage input, each switch within a pair ofswitches is configured to be switched in-phase with the other while thefirst pair of switches is to switch out of phase with the second pair ofswitches. A balancing capacitor is coupled at intermediate switch nodes,across one switch in both the first and second pair to be in parallelwith that switch when either of the pair of switches is closed to reducea charge imbalance resulting from a mismatch between the switches of thepair of switches.

However, particular embodiments may be practiced without one or more ofthese specific details, or in combination with other known methods,materials, and apparatuses. In the following description, numerousspecific details are set forth, such as specific materials, dimensionsand material parameters etc. to provide a thorough understanding of thepresent invention. In other instances, well-known design and fabricationtechniques have not been described in particular detail to avoidunnecessarily obscuring the present invention. Reference throughout thisspecification to “an embodiment” means that a particular feature,structure, material, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention.Thus, the appearances of the phrase “in an embodiment” in various placesthroughout this specification are not necessarily referring to the sameembodiment of the invention. Furthermore, the particular features,structures, materials, or characteristics may be combined in anysuitable manner in one or more embodiments. For example, a firstembodiment may be combined with a second embodiment anywhere the twoembodiments are not mutually exclusive.

In embodiments of the present invention, series switches are employed ina hybrid power conversion stage including a voltage converter of a firsttype and of a second type configured in parallel to provide a regulatedoutput current from a common input voltage. Generally, this parallelarrangement may include a first converter type capable of highefficiency at higher loads and a second converter type capable of highefficiency at lower loads to provide high efficiency across a wide rangeof loads.

In one embodiment, a switched capacitor converter is employed inparallel with a second type of converter operated as a current source.One exemplary implementation is depicted in FIG. 2A. As shown, powerdelivery network 200 includes a switched capacitor divider (SCD) 220configured in parallel with a voltage regulator (VR) 215. Such switchedcapacitor divider embodiments have the advantage of providing multipleground referenced DC voltage levels (N−1 DC voltage outputs in adivide-by-N circuit). However, other switched capacitor convertercircuits which may not produce such a plurality of voltages may also beused in other embodiments. Both the SCD 220 and VR 215 are coupled withthe voltage input V_(in) and both the SCD 220 and VR 215 are coupled toa common output circuit driving a load current I_(o). The SCD 220 may beoperated at high efficiency when under light loads and the VR 215 is aregulator which can be configured to operate as a current source thathas high efficiency at heavy loads. The VR 215 can be used to direct theload current away from the SCD 220 at heavy loads so that the SCD 220 isutilized predominantly at light loads while the VR 215 is utilizedpredominantly at heavy loads. Control of the proportion of load currentI_(o) provided by the VR 215 may thereby maintain a maximum efficiencynot otherwise possible from either the SCD 220 or VR 215 alone.

The SCD 220 is a switched capacitor network which generally operates asa charge pump or DC transformer and may be employed for conversion of DCvoltages. Particular switched capacitor network topologies suitable forIC power delivery are described in U.S. patent application Ser. No.11/694,391, filed Mar. 30, 2007, commonly owned. As disclosed therein,such switched capacitor networks are readily scaleable to providemultiple power rails and outputs, as required, for powering any numberof IC's at a variety of operating voltages.

In one particular implementation, SCD 220 is the divide-by-four switchedcapacitor divider (divide-by-4 SCD) 221 depicted in FIG. 2B. Otherswitched capacitor dividers, such as divide by 2 or 3, are alternateembodiments, as are capacitance values selected such that the voltagedivider ratio is not an integer. Such switched capacitor dividerembodiments have the advantage of providing multiple ground referencedDC voltage levels (N−1 DC voltage outputs in a divide-by-N circuit), butother switched capacitor circuits which may not produce such a pluralityof voltages may also be used.

As depicted, divide-by-4 SCD 221 includes series connected switchesSW1-SW8. The switches may be implemented with insulated gate FETs(IGFETs), vertical MOS (VMOS), lateral diffused MOS (LDMOS) or othercommonly known power transistor technologies. However, in a preferredembodiment, the series switches in divide-by-4 SCD 221 are implementedwith CMOS transistors of the type typically employed for low voltage(e.g., 1.5 V) logic applications. Capacitors C1 through C7 are coupledacross the input voltage, V_(in), across the series switches SW1-SW8 todivide V_(in) by parts. In the particular embodiment depicted, capacitorC4 is in parallel with one of the four adjacent pairs of A/B seriesswitches to provide a voltage division that is one-fourth of the Vin(V_(o)=¼V_(in)) for the divide-by-four switched capacitor divider (SCD)221. Nodes between the other capacitors C1, C2, and C3 may similarlyprovide outputs at V_(in), ¾V_(in), and ½V_(in). These nodes are notused in the example of FIG. 2B, but may be used to supply additionalvoltage levels for a different implementation. Because the voltagelevels within the switched capacitor stage is at a fraction of the inputvoltage, the efficiency of the second stage may be considerablyimproved.

As depicted, capacitors C1, C2, C3 and C4 each span adjacent A/B switchpairs of the plurality of series switches while capacitors C5, C6 and C7each span adjacent B/A switch pairs of the plurality of series switches.For the eight switches, numbered SW1 to SW8, from high (V_(in)) to low(ground), C1 is coupled at high and between SW2 and SW3. C2 is coupledacross a node between SW2 and SW3 and a node between SW4 and SW5. C3 iscoupled across the node between SW4 and SW5 and a node between S6 andS7. C4 is coupled across the node between SW6 and SW7 and low. Thebalancing capacitors starting with C5 are coupled across the othernodes. C5 is coupled across a node between SW1 and SW2 and a nodebetween SW3 and SW4. C6 is coupled across the node between SW3 and SW4and a node between SW5 and SW6. C7 is coupled across the node betweenSW5 and SW6 and a node between SW7 and SW8. The capacitance values ofcapacitors C1-C7 depend upon the current demands on the power deliverynetwork. For typical applications, the capacitance values for C1-C7 maybe all equal and in certain embodiments, the capacitance value for eachcapacitor is between 10 micro Farads (uF) and 100 uF.

Alternating ones of the series FET switches (e.g., switches A) are allcoupled together at their gate pins and, during operation, are coupledto a “high” signal during a time period DTs while alternating ones ofthe series FET switches (e.g., switches B) are all coupled together attheir gate pins and driven with a “high” signal during a remaining timeperiod (1−D)Ts, where Ts is the total switching cycle and D is the dutycycle and is typically 50% or less. As such, during a first timeinterval of the switching cycle, DTs, the A switches are “on” (driven bya digital high signal) while the B switches are “off” (driven by adigital low signal). During the remaining time interval of the switchingcycle (1−D)Ts, the B switches are “on” (driven by a digital high signal)while the A switches are “off” (driven by a digital low signal). Thus,while both A and B are driven “on” during some portion of the switchingcycle, A and B are not driven “on” simultaneously during the overallswitching cycle lasting Ts.

Generally, VR 215 may be any type of voltage converter or regulatorconfigurable to operate in a current mode. In that sense, VR 215 may beconceptualized also as a current regulator, in which case the SCD 220 isa voltage converter configured in parallel with a current regulator. Ineither respect, VR 215 may be, but is not limited to, a buck converteror a linear regulator. FIGS. 3 and 4 depict the alternate embodiments ofVR 215 as a buck converter or linear regulator. In FIG. 3, the linearregulator 315 in power delivery network 300 is in parallel with the SCD220. FIG. 4 depicts an alternate implementation where the buck converter415 in power delivery network 400 is in parallel with SCD 220. Whileboth linear regulator 315 and buck converter 415 may be configured foruse as current sources, linear regulator 315 typically will have a lowerefficiency than the buck converter 415 at heavy loads. However,embodiments with the linear regulator 315 are somewhat less complicatedand less expensive than buck converter embodiments. Thus, depending onthe efficiency and cost constraints, either implementation may bepreferable.

Power delivery networks 200, 300 and 400 all provide a means to improvetransient response because the output impedance can be altered. Forexample, the converters may be designed to complement or compensate eachother's output impedance. In one particular embodiment, the path throughthe VR 215 (e.g., LR 315 or buck converter 415) has a low impedance(e.g., lower impedance than the SCD 220) so that the VR 215 may quicklyrespond to load transients by providing more or less of load currentI_(o).

FIG. 4B is a schematic of a simulation for a parallel hybrid powerdelivery network employing a divide-by-four switched capacitor dividerin parallel with a buck converter, in accordance with the embodimentdepicted in FIG. 4A. As shown in FIG. 4B, buck converter 415 is modeledas an average current mode controlled (ACMC) buck converter connected inparallel with the divide-by-4 SCD 221 of FIG. 2B. The buck converter 415acts as a current source. As, further shown in FIG. 4B, the referencecurrent in the buck converter 415 is set with proportional control. Inthe simulation, an exemplary 12V DC voltage input is applied.

FIG. 5A and FIG. 5B are graphs depicting a simulation of adivide-by-four switched capacitor divider, operated without a buckconverter in parallel, and with a buck converter in parallel (e.g., asin FIG. 4B), respectively. With the 12V DC input, the nominal output ofthe divide-by-4 SCD 221 is 3V. A 1 A to 25 A loading and unloadingtransient response is shown for both graphs. Because this exemplaryembodiment of the SCD 221 has no output regulation, and the switchingfrequency remains constant for all loads, the output-voltage variationdepends strongly on the load. With no load, the output voltage V_(o)corresponds to the input voltage V_(in) and as the load increases, V_(o)decreases. As shown in FIG. 5A, the output voltage V_(o) of thedivide-by-4 SCD 221 drops to less than 2.5V with load I_(o) due toparasitic output resistance of the divide-by-4 SCD 221. As depicted inFIG. 5B, with the addition of the parallel buck converter 415, theoutput voltage V_(o) drops significantly less (e.g., 2.75 V). FIG. 5Bfurther depicts with a dashed line the portion of output current I_(o)provided by the buck converter 415 (I_(o Buck)) and the divide-by-4 SCD221 (I_(o SCD4)). In this manner, the portion of I_(o) provided by buckconverter 415 may be controlled to achieve higher efficiency across awide range of loads with the parallel hybrid power network described.

In a further embodiment, a control strategy more sophisticated than theproportional control of FIG. 4B is employed to further optimize theefficiency of the parallel converters during operation of the powerdelivery network 200 (e.g., network 300 or network 400). Generally, thecontrol problem is to determine the amount of load current the VR 215 ofFIG. 2A should help deliver. This may be determined by examining theindependent efficiencies of both converters as functions of loadcurrent. The control should track the maximum efficiency, with the SCD220 operating under light loads and the VR 215 turning on at heavyloads.

In the exemplary embodiment depicted in FIG. 5C, power delivery network500 includes a maximum efficiency tracker 510 and a current controller560 in addition to the VR 215 and SCD 220. During operation, the maximumefficiency tracker 510 determines a feed-forward reference value (e.g.,i_(ref)) based on a predetermined control relationship between thecurrent provided by VR 215 and SCD 220 for a given input current (e.g.,i_(in)) that will provide maximum efficiency for the particularefficiency characteristics of VR 215 and SCD 220. For example, thepredetermined control relationship may be provided in a lookup table orvia a closed form algorithm solvable for the portion of I_(o) to beprovided by the VR 215 based on an independent variable (e.g., i_(in)).As further shown, current controller 560 then provides a control signalto VR 215 based on the feed-forward signal i_(ref) along with thefeedback signal i_(VR). The current controller 560 may then determine acontrol signal output to VR 215 to minimize a difference between i_(ref)and i_(VR).

The load current where the efficiencies of the VR 215 and SCD 220 areequal is the transition current. In one embodiment, at loads higher thanthe transition current, the VR 215 is used exclusively, and at loadsbelow the transition current, the SCD 220 is used exclusively to providethe output current, I_(o). An example plot of efficiencies is depictedin FIG. 5D. Two different implementations of an SCD 220 are plottedalong with a buck converter implementation of VR 215 (e.g., buckconverter 415). As shown, the transition current is around 10 A or 15 A,depending on the SCD implementation. The dashed line is an SCD 220implemented with low voltage switches typical of logic CMOS integratedcircuits (IC), whereas the solid line is for an implementation usingcommercially available discrete switches, typically employing powerMOSFETs. Thus, both the maximum efficiency attainable and the loadcurrent at which the VR 215 should begin operation are dependent onperformance characteristics of a particular implementation (e.g.,parasitic output resistances and parasitic inductances of the SCD 220,switching frequency (η), conversion efficiency of buck converter 415,etc.).

FIGS. 6A, 6B and 6C depict exemplary embodiments of power deliverynetworks employing the parallel hybrid converter configuration of FIG.2A to provide power to one or more ICs 640, 645 and 650. Althoughdepicted as a plurality of ICs, each requiring a specific voltage, otherembodiments include a plurality of functional interfaces requiringmultiple voltage rails packaged in a single IC. The VR 215 for any ofthese embodiments may be any of those previously described, such aslinear regulator 315 or buck converter 415. Similarly, SCD 220 may beany of those previously described for the parallel hybrid converterconfiguration of FIG. 2A (e.g., a divide-by-4 SCD 221) or a non-dividingswitched capacitor converter.

Referring to FIG. 6A, in system 600 each of the ICs 640, 645 and 650 tobe powered can be of any known type, such as a microprocessor ormicrocontroller, memory circuit, application specific integrated circuit(ASIC), digital signal processor (DSP), a radio frequency circuit, anamplifier, a power converter, a filter, a clocking circuit, and thelike. In a preferred embodiment, the IC 640 is a central processor of anelectronic device while IC 645 and IC 650 may be any of the output loadcircuits described in reference to FIG. 1 (e.g., memory chip, PCIExpress compliant chip, etc.). Depending on the nature of ICs 640, 645and 650, etc., system 600 may be a mobile computing device, otherelectronic device, etc. Motherboard 605 supports the ICs 640, 645 and650 and may be a printed circuit board of any suitable type and can bemade of any suitable material, e.g., an organic material, a polyimide,silicon, glass, quartz, ceramic, and the like.

As further shown in FIG. 6A, an input voltage V1 is provided. Wheresystem 600 is an ultra-mobile platform, V1 may be from a battery, suchas Li-ion cell(s) 106 with supply voltages in the range of about 2.8 Vto 4.2 V/cell. In other embodiments, V1 may be approximately 12V, suchas commonly provided by a motherboard supply voltage for a desktopcomputer platform. V1 is coupled with the SCD 220 and VR 215 configuredin parallel. V2, output by the SCD 220 and/or VR 215 then serves as astage (e.g., 2.5V) in a multi-stage power delivery network which iscoupled to one or more subsequent point of load (POL) voltage regulators111, 112 and 113 to provide V3, V4 and V5 (e.g., 1.3V-2.5V). Each of thePOL voltage regulators 111, 112 and 113 is then coupled with IC 640, 645and 650, respectively. Each of the POL voltage regulators 111, 112 and113 may be a switched capacitor divider similar to SCD 220 or anyconventional voltage/current converter/regulator, such as but notlimited to, a buck converter or a linear regulator. In a particularembodiment, to conserve motherboard area, at least one regulation stageis integrated onto the package of the IC. For example, a package ofprocessor IC 640 may include buck-type or a SCD-type VR 111.

System 600 thereby provides multi-stage power regulation with the firststage including a plurality of converters of different types in parallelto provide high efficiency across a wide range of load currentsdependent on the activity of distinct POL (e.g., individual ICs 640, 645and 650). Embodiments such as system 600 are advantageous where thetotal load across a plurality of ICs is not always great enough to keepVR 215 operating at a point of maximum efficiency but may occasionallyexceed a load where SCD 220 has high efficiency. One example is a lowpowered portable device which has a number of features such as USBinterface(s), memory, SATA interface(s), etc., only a subset of which bedrawing significant current at any given time.

In another embodiment, depicted in FIG. 6B, system 660 providesmulti-stage power regulation wherein at least one POL stage employs aparallel hybrid converter configuration such as that of FIG. 2A. Asfurther depicted, the VR 110 regulates a V1 to V2 as a first stage in amulti-stage power delivery network. V2 is then coupled with the input ofboth VR 215 and SCD 220 configured in parallel as a POL power deliverystage to output V3 to IC 640. In further embodiments, any number of POLregulator stages may include an SCD 220 in parallel with VR 215. Forexample, VR 112 and VR 113 may similarly be configured in parallel witha switched capacitor divider. Embodiments such as system 660 areadvantageous where the total load across the plurality of ICs 640, 645and 650 is high enough that a buck-type regulator would be predominantlyoperated at a high efficiency point, but a particular POL regulationstage may vary across low and high load operating points.

In still another embodiment, as depicted in FIG. 6C, system 675 includesa plurality of power delivery stages with each stage comprising aparallel hybrid converter stage. In such a configuration, a first powerdelivery stage comprising the SCD 220 in parallel with the VR 215 iscoupled with an input voltage V1 (e.g., from Li-Ion cell(s) 106) toprovide an output current at V2. V2 is coupled with a POL regulationstage comprising a second VR 615 in parallel with a second SCD 620 toprovide an output at V3. In further embodiments, VR 112 and VR 113 maysimilarly include a switched capacitor divider, such as SCD 620, toprovide the outputs at distinct voltages V4 and V5 for IC 645 and 650,respectively. Embodiments such as system 675 are advantageous where thetotal load across the plurality of ICs 640, 645 and 650 is not alwaysgreat enough to keep VR 215 operating at a point of maximum efficiencybut may exceed that were SCD 220 has high efficiency and a particularPOL regulation stage, such as that coupled to IC 640, may also varyacross low and high load operating points.

In another embodiment, converters of different types are configured inseries for a series hybrid converter power delivery network. Forexample, one or more POL voltage regulators, such as VR 111, 112 and 113of FIG. 1, are replaced with a single switched capacitor divider circuitcoupled with one or more linear regulators. System 700 is depicted inFIG. 7A, is an embodiment of such a power delivery networkconfiguration.

As shown in FIG. 7A, an input voltage V1 is provided from Li-Ion cell(s)106 and regulated to V2 with a first stage VR 110. Then, as a secondstage, three output voltages V3, V4 and V5 are provided as linearregulated rails of the multiple-output switched capacitor divider (SCD)720. SCD 720 may be any of those described in reference SCD 220 to FIG.2B and in this embodiment is a divide-by-4 switched capacitor divider.Linear regulator (LR) 725 is coupled to one output of SCD 220 as is LR730 and LR 735. Linear regulators 725, 730 and 735 may be of any typeknown in the art. The ability for the SCD 220 to provide multiple groundreferenced DC voltages (e.g., N−1 DC voltage outputs for a divide-by-Ncircuit) enables a highly compact means of providing the plurality ofrails at V3, V4 and V5, respectively. SCD 200 may require a smaller areaof motherboard 605 to provide a plurality of voltage rails than wouldthe conventional network 100 of FIG. 1 because no magnetic components,such as standalone or coupled inductors, are employed. Also, because theSCD 220 is highly efficient at light loads, the switching losses ofbuck-type converters may be avoided. Furthermore, because the size ofSCD 220 is not inversely related to switching frequency as is aninductor-based converter, lower switching frequencies may be acceptablewhere output currents are low, such as in an ultra-mobile computingplatform.

FIG. 7B depicts a circuit topology for a simulation of a multi-outputSCD 720 coupled with a plurality of LR 725, 730 and 735. Load current I3is supplied at DC voltage V3, load current I2 at DC voltage V4 and loadcurrent I1 and DC voltage V5. For a simulated V2 of 12V input to SCD720, the nominal outputs of the SCD 720 include 9V, 6V and 3V rails.Because the rails have parasitic inductance and output resistance, theoutput voltages drop when loaded with 1 A to approximately 8.8V, 5.8Vand 2.8V, each regulated linearly. As long as the output voltage railsare properly chosen, the linear regulators 725, 70 and 735 can operatewith reasonably high efficiency.

Certain embodiments of the voltage regulators described herein utilizeseries connected switch bridges. FIG. 8 depicts an exemplary bridgecircuit 800 with series connected switch pairs forming a top and bottomswitch path. As shown, a first pair of switches 810 is in series, with adrain terminal of a first switch coupled to a source terminal of asecond switch and gate terminals of the first pair coupled together, fora top switch path and a second pair of switches 820 similarly configuredin series with gates coupled for a bottom switch path. The first pair ofswitches 810 is in series with the second pair of switches 820 with aninput voltage V_(in) across the two pairs of switches. V_(bridge) is theoutput bridge voltage coupled at a node between the two pairs ofswitches 810 and 820.

Gate signals 850 depict the logic levels during operation showing therelative duty cycle for the bridge circuit with the “A” gate signalapplied to the first pair of switches 810 and the “B” gate signalsapplied to the second pair of switches 820. As depicted, duringoperation, the first pair of switches 810 are coupled to a “high” signalduring a time period DTs while the second pair of switches 820 aredriven with a “high” signal during a remaining time period (1−D)Ts,where Ts is the total switching cycle and D is the duty cycle and istypically 50% or less. As such, during a first time interval of theswitching cycle, DTs, the first pair of switches 810 are “on” (driven bya digital high signal) while the second pair of switches 820 are “off”(driven by a digital low signal). During the remaining time interval ofthe switching cycle (1−D)Ts, the second pair of switches 820 are “on”(driven by a digital high signal) while the first pair of switches 810are “off” (driven by a digital low signal). Thus, while both pairs ofswitches are driven “on” during some portion of the switching cycle, thetwo pairs are not driven “on” simultaneously during the overallswitching cycle lasting Ts.

Each switch of the first pair of switches 810 includes a characteristicparasitic output capacitance, C_(sw1) and C_(sw2). Similarly, eachswitch of the second pair of switches 820 includes a characteristicparasitic output capacitance, C_(sw3) and C_(sw4). The input voltagewill divide across these capacitances when the respective switch isturned off. With each switch of an individual switch pair operated inunison, the capacitance value of adjacent switch pairs determines thevoltage division. If these capacitance values are equal, then the inputvoltage will divide equally. However, equal capacitance is unlikelybecause semiconductor switches have parasitic capacitances that varynonlinearly with applied voltage and a certain amount of mismatchbetween the series connected switches (e.g., MOSFET channel width andlength, threshold voltage, drain-source capacitance, transconductance,etc.) can be expected. Because any imbalance in voltage division canpreclude use of low voltage switches by reducing the voltage margin of aseries switch design, a balancing capacitor, (e.g., C_(bal) in bridgecircuit 800) is connected at the intermediate switch points. Duringoperation, when a switch path is turned on, the balancing capacitorappears in parallel with a parasitic output capacitance of one switch ofa pair of the series switches.

For example, in bridge circuit 800, when the first pair of switches 810is turned on, the balancing capacitor, C_(bal), appears in parallel withC_(sw2) and when the second pair of switches 820 is turned on, C_(bal)appears in parallel with C_(sw3). A charge imbalance between C_(sw2) andC_(sw3) is thereby reduced as C_(bal) switches between the two states.In one such embodiment, C_(bal) has a capacitance value at least twoorders of magnitude larger than the parasitic switch capacitances,C_(sw1)-C_(sw4). In a further embodiment, C_(bal) has a capacitancevalue sufficiently large that the voltage across it is nearly DC andequal to approximately half the input voltage.

In one particular embodiment, the switches employed in the bridgecircuit 800 have lower voltage ratings than the total voltage appliedacross the bridge. A switch with a lower voltage rating than the totalapplied voltage V_(in) may then be employed because the voltage marginwill not be exceeded to the extent it would without a balancingcapacitor. A bridge circuit including pairs of series switches and abalancing capacitor spanning separate ones of the pairs can therebyprevent switch damage. As an example, a schematic for a simulation ofthe circuit topology depicted in FIG. 8 is shown in FIG. 9A. In thissimulation, all switches are NMOS devices. As shown, the parasiticoutput capacitances C1, C3 and C4 are modeled at 0.1 nF while C2 ismodeled at 0.2 nF. The balancing capacitor C5 is modeled at 50 nF.

Simulation data for the schematic of FIG. 9A is depicted in FIG. 9B. Thetrace depicted in FIG. 9B is the difference between the two drain-sourcevoltages across the first pair of switches (e.g., S-U2D and S-U3D inFIG. 9A) in the bridge for the input parameters further provided in FIG.9B. The trace depicted in FIG. 9C is for a simulation run without abalancing capacitor (e.g., C5 in FIG. 9A). The difference between thetwo traces shows that the balancing capacitor as a voltage balancingmeans between the series switch pairs of the bridge circuit reduce thedrain-source voltage imbalance by nearly a factor of 3 (e.g., 100 mV vs.300 mV). This improvement in voltage imbalance can improve theefficiency by a few percentage while increasing the overall lifetime ofthe switches.

In a particular embodiment, a voltage regulator includes a seriesconnected bridge configuration, such as that depicted in FIG. 8,implemented with low voltage MOS switches conventionally utilized inCMOS technologies. Either NMOS or PMOS devices may be employed. With theability to employ low voltage CMOS switches in bridge circuits, thelower manufacturing costs and higher integration associated with CMOStechnologies can improve performance and reduce size of a voltageregulator or power delivery network, such as any of those describedelsewhere herein. In one exemplary implementation, an input to a DCvoltage across a bridge is approximately 3V while the switches are ratedfor conventional 1.5V logic CMOS applications. In one suchimplementation, two 1.5V MOS switches are connected in series to reducethe 3V input to a 1.5V stress across each switch as the series pairs arealternately switched on and off. In a further implementation, the seriesswitch bridge is integrated with low voltage CMOS FETs onto the packageof the IC to be powered. In other embodiments, other types of commonlyknown switches (power FETs, etc.) may be employed in a series switchbridge circuit having a balancing capacitor (e.g., bridge circuit 800).

Thus, series switches for hybrid switched capacitor networks for powerdelivery to an IC have been described. One or more of the embodimentsdescribed in detail may be employed to provide at least one stage in apower delivery network to power a processor or other packaged integratedcircuit (IC). Although the present invention has been described inlanguage specific to structural features or methodological acts, it isto be understood that the invention defined in the appended claims isnot necessarily limited to the specific features or acts described. Thespecific features and acts disclosed are to be understood merely asparticularly graceful implementations of the claimed invention in aneffort to illustrate rather than limit the present invention.

1. A power delivery network for an integrated circuit, the networkcomprising: a hybrid parallel power conversion stage including converterof a first type configured in parallel with a converter of a secondtype, each converter coupled with an input voltage to provide aregulated output current to power the integrated circuit.
 2. The powerdelivery network of claim 1, wherein the converter of the first type isa switched capacitor converter and the converter of the second type isconfigured as a current source.
 3. The power delivery network of claim1, wherein the switched capacitor converter is a switched capacitordivider and wherein the converter of the second type is a buck regulatorconfigured to operate in a current mode.
 4. The power delivery networkof claim 1, wherein the switched capacitor converter is a switchedcapacitor divider and wherein the converter of the second type is alinear regulator configured to operate as a current source.
 5. The powerdelivery network of claim 3, wherein the integrated circuit is amicroprocessor, the switched capacitor divider includes a plurality oflow voltage logic MOSFETs configured in series across the input voltage.6. The power delivery network of claim 1, further comprising a currentcontroller coupled with the converter of the second type to set theportion of the regulated output current provided by the converter of thesecond type.
 7. The power delivery network of claim 1, furthercomprising a voltage regulator stage configured in series with thehybrid parallel power conversion stage, wherein the voltage regulatorstage output is coupled with an input to the hybrid parallel powerconversion stage or the voltage regulator stage input is coupled with anoutput of the hybrid parallel power conversion stage.
 8. The powerdelivery network of claim 7, wherein the voltage regulator stage furthercomprises at least one of a buck regulator or a linear regulator.
 9. Thepower deliver network of claim 4, wherein the switched capacitor dividerfurther comprises: a plurality of FETs configured with drain terminalscoupled with source terminals to be in series across a voltage input;and a plurality of capacitors connected across the voltage input andcoupled with the series switches to divide the input voltage into aplurality of first voltage outputs; and a plurality of linearregulators, each linear regulator coupled with one of the plurality offirst voltage outputs to regulate a second voltage output.
 10. The powerdeliver network of claim 9, wherein alternating ones of the plurality ofFETs have gate terminals coupled together to form a first and secondpair of gate coupled FETs, and wherein the first pair of gate coupledFETs is configured to switch between a low state and a high state withina switching cycle while the second pair of gate coupled FETs isconfigured to switch to a state opposite the first pair of gate coupledFETs; and wherein the plurality of capacitors further comprise: a firstcapacitor coupled to a drain terminal of each of the first pair of gatecoupled FETs; and a second capacitor coupled to a drain terminal of eachof the second pair of gate coupled FETs.
 11. A power delivery network todeliver power one or more integrated circuits at a plurality ofvoltages, the network comprising: a switched capacitor divider (SCD)comprising: a plurality of FETs configured with drain terminals coupledwith source terminals to be in series across a voltage input; and aplurality of capacitors connected across the voltage input and coupledwith the series switches to divide the input voltage into a plurality offirst voltage outputs; and a plurality of linear regulators, each linearregulator coupled with one of the plurality of first voltage outputs toregulate a second voltage output.
 12. The power delivery network ofclaim 11, wherein alternating ones of the plurality of FETs have gateterminals coupled together to form a first and second pair of gatecoupled FETs, and wherein the first pair of gate coupled FETs isconfigured to switch between a low state and a high state within aswitching cycle while the second pair of gate coupled FETs is configuredto switch to a state opposite the first pair of gate coupled FETs; andwherein the plurality of capacitors further comprise: a first capacitorcoupled to a drain terminal of each of the first pair of gate coupledFETs; and a second capacitor coupled to a drain terminal of each of thesecond pair of gate coupled FETs, both of the first and secondcapacitors to be alternately charged and discharged within the switchingcycle when the first and second pairs of gate coupled FETs are switchedbetween low and high states.
 13. The power delivery network of claim 11,further comprising a buck regulator stage to provide the input voltageto the SCD.
 14. The power delivery network of claim 11, wherein each ofthe plurality of linear regulators is coupled to an output circuitincluding one of the plurality of ICs.
 15. A power delivery network topower an integrated circuit, comprising: a voltage input; and a seriesswitch bridge, wherein the series switch bridge further comprises: afirst pair of switches connected in series with a second pair ofswitches across the voltage input, wherein each pair of switchesincludes a first switch having a drain terminal coupled with a sourceterminal of a second switch with gate terminals coupled together, andwherein the first pair of switches is configured to switch between a lowstate and a high state within a switching cycle while the second pair ofswitches is configured to switch to a state opposite the first pair; abalancing capacitor coupled with a node between the switches of thefirst pair and coupled with a node between the switches of the secondpair; and a voltage output coupled with a node between the first pair ofswitches and the second pair of switches, the voltage output to becoupled with the IC to be powered.
 16. The power delivery network ofclaim 15, wherein the voltage input is at least 3V and the switches arelow voltage logic FETs configured to operated at approximately 1.5V. 17.The power delivery network of claim 15, wherein the balancing capacitorhas a capacitance value at least an order of magnitude larger than aparasitic output capacitance of any switch of the first and secondswitch pairs.
 18. The power delivery network of claim 15, wherein theseries switch bridge is integrated with low voltage CMOS FETs onto thepackage of the integrated circuit.
 19. The power delivery network ofclaim 15, wherein the first pair and second pair of switches comprises abridge circuit providing an output voltage equal to approximately halfthe voltage input.
 20. The power delivery network of claim 15, whereinthe series switch bridge is a component of voltage regulator.